The real black technology is coming. Micron will package the memory and storage together to reduce the size

On March 11, Micron announced that its first uMCP multi-chip package module that integrates LPDDR5 memory and UFS 2.1 flash memory has officially sent samples, and has sent samples to partners, which is expected to bring more savings to 5G mobile phones. Electricity and high-efficiency storage technology.

The real black technology is coming. Micron will package the memory and storage together to reduce the size

According to Micron’s data, uMCP encapsulates the three parts of memory, storage, and controller together. Such an integrated process can reduce the transmission distance between chips, thereby making data exchange more efficient and power consumption. reduce. Another advantage of the integration process is that it can reduce the volume of the memory. According to the data provided by Micron, the memory volume of the uMCP package can be reduced by 40%.

The real black technology is coming. Micron will package the memory and storage together to reduce the size

Micron’s uMCP uses 1ynm DRAM LPDDR5 memory, 512Gb 96-layer 3D NAND particles plus 279 ball grid array package/BGA, supports dual-channel LPDDR5, speeds up to 6,400MBps, and can provide up to 12GB RAM + 256GB ROM combination.

Although Micron’s sample uses UFS 2.1, it is not ruled out that UFS 3.0 will be actually used in the product. Today, when the internal space of mobile phones is an inch of gold, this solution of Micron can save the interior of the fuselage. Many spaces allow mobile phone manufacturers to have more choices, such as increasing battery capacity and so on. If the plan goes well, we may be able to see a mobile phone packaged with memory and storage this year.

Author: NJNR103

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